The testing machine designed and manufactured by KYEC is one of the most cost-effective test platforms and solutions on the market. Advantages include
KYEC in-house designed testers offer unique and differentiated professional testing outsourcing services for the global semiconductor industry, thereby reducing total testing expenses substantially. Hence, the products of our clients can be launched immediately and at competitive costs.
The KYEC in-house designed test platform fully integrates machine performance, mechanism interfaces and system programs. In addition to its technological advantage, the design features a full integration of production technologies of key parts (e.g., machinery and equipment spare parts) and the development and innovation of software and hardware interfaces. This integration can enhance production efficiency and output effectively. This is a comprehensive test solution that yields compatibility (flexibility) and expansibility (customization).
Initially the KYEC in-house designed test platform provided product testing services for chips of mixed-signal, power management IC and RF. These services were based on logic and analog test modules designed specifically for the platform. Currently, the platform has been expanded, featuring high-speed test module mechanisms (e.g., MEMS-G/P sensor and CMOS module) and the design and development of key technologies and parts (e.g., technologies for developing and manufacturing strip handlers, and the design and development of VCPC high-frequency test boards). In the future, KYEC research teams will develop comprehensive logic IC testing technologies.
The successful development of an in-house designed testing machine solution for 200-MHz and above can satisfy the testing needs of more than 95% of the medium to low-end logic products in the world. Products being mass produced currently are as follows: Audio, Base band, Bluetooth, Memory card controller, CIS, Consumer, Digital-TV, DVD, LCD Driver, Toy, MCU, MP3 Codec, OA, OM, PC Cam, Power, RF_IC, Sata, USB2.0/ USB3.0/ PCIE3.0 , FPGA, MEMS, NFC, Touch
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