To effectively enhance test yield and efficiency while reducing the cost of key components and peripheral equipment, King Yuan Electronics (KYEC) has established a dedicated team to develop proprietary cutting-edge automation control technologies, critical equipment component manufacturing techniques, and advanced machining processes. Deeply rooted in semiconductor smart manufacturing, KYEC provides advanced hardware automation and integrated software control (Burn-In). By seamlessly combining high-level automation and intelligence, KYEC builds a comprehensive closed-loop ecosystem spanning storage, material feeding, testing, and sorting—maximizing production efficiency, minimizing human intervention, and ensuring test quality.

• Strip Test & MEMS Test Development: Proprietary Strip Test and Micro-Electro-Mechanical Systems (MEMS) test capabilities enable in-house automated process equipment development, equipment upgrades, and tailored test environment setups.
• Auto Exchanger, Tape & Reel Machine, and Low-Temperature Systems: Custom-developed Auto Exchangers, Tape & Reel (T&R) machines, and low-temperature systems address production line demands and internal equipment enhancements.
• Process Improvement Projects: Proprietary key components—including Change Kits, Docking systems, and Hi-Fix—streamline operations into faster, simpler, and more stable procedures.
• Key Component Development: In-house design and fabrication of components such as K-PINs, Pogo Towers, Sockets, Hinges, and Manipulators, integrated with peripheral equipment design and production anomaly analysis.
• Workpiece Material & Coating R&D: Research into materials, coatings, and machining processes—such as K-PIN machining techniques and vendor-partnered process developments—boosts throughput, optimizes workflows, and lowers production costs.
• Process Automation Modules:
  1. AGV / AMR Material Delivery: Autonomous Mobile Robots (AMR) and Automated Guided Vehicles (AGV) deliver unmanned material transfer between factory stations (e.g., storage and burn-in areas) for CP (Chip Probe) and FT (Final Test) processes, creating flexible smart workshops.
  2. Automated Storage and Retrieval System (AS/RS): Integrates Warehouse Management Systems (WMS), robotic arm tooling, and Burn-In Board (BIB) auxiliary systems (KBC) to replace manual handling. This delivers high-density automated storage, real-time tracking, and inventory optimization for raw materials and test boards.
  3. Automatic Binning: Intelligent inspection and sorting mechanisms automatically bin chips based on test data and performance, ensuring precise classification for diverse market demands.
• Automated Optical Inspection (AOI) & Vision Recognition System: High-precision robotic arms paired with optical inspection perform Probe Card tip inspection, Wafer Probe Mark depth measurement, IC cosmetic inspection, socket pogo pin verification, personnel behavior recognition, and security alerts. Integrated Optical Character Recognition (OCR) automates IC top-mark inspection and data entry, establishing error-proofing mechanisms that prevent defective units from entering test flows and driving yield and throughput.
• Automation Software & System Integration: Serving as the system's central nerve center, this software deeply connects AS/RS, AGVs, vision-assisted handlers, binning machines, and liquid-cooling burn-in systems. A centralized monitoring platform enables real-time dispatching, data visualization, and remote management toward Industry 4.0.
• KYEC Intelligence Testing Solutions (KITS): Delivers specialized test capabilities including Burn-In (BI) testing with automated Burn-In Rack development, System Level Testing (SLT), and custom test solutions.

KYEC will continue leveraging its automation R&D and hardware-software integration capabilities to empower global semiconductor partners in building efficient, intelligent, and sustainable advanced test lines.