Test Load Board Design and Development

The KYEC R&D team possesses the expertise to design, develop, and manufacture Printed Circuit Boards (PCBs), Probe Cards, Load Boards, and Docking interfaces. The development of customized key components enhances the efficiency and throughput of customers' product testing. Furthermore, by integrating flying probe testing to ensure circuit board continuity and signal integrity, KYEC strives to fully meet customer requirements and maintain high-quality standards.

KX-100 Impedance Measurement Equipment Development

The KX-100 is an in-house developed system by KYEC designed to measure spring contact resistance, and it has been in practical use for over four years. Utilizing an off-line measurement approach, it evaluates the contact conditions and cleaning effectiveness of sockets and pins. This allows for the identification of optimal in-line and off-line cleaning parameters, facilitating the early detection of socket anomalies and ultimately improving production yield.

Testing program development and test platform conversion

By leveraging test platform conversion capabilities alongside the flexibility and compatibility of our in-house development, we continuously deliver a diverse range of testing solutions. This approach significantly reduces test equipment costs and shortens both platform migration and testing times, ultimately enhancing our customers' cost competitiveness.

Integrated Key Components (Burn-In System)

Integrated Hardware and Software Development of Key Components (Burn-In System)。KYEC is dedicated to providing reliability verification solutions for next-generation advanced computing chips. By deeply engaging in the integrated development of key hardware components and software, KYEC creates highly efficient, precise, and stable large-scale Burn-In testing environments for Artificial Intelligence (AI) and High-Performance Computing (HPC) chips.

Addressing the thermal management and testing challenges of high-power chips under extreme loads, KYEC leverages its profound mechanical design expertise and precise software control technology to develop a comprehensive, in-house liquid cooling test architecture. Our core technologies encompass the following:

• High Power Burn-In System: Developing high-density, high-performance chip burn-in and extreme testing environments and systems, elevating the rigor of electrical and thermal load endurance tests for chips.

• High Power Burn-In Cold Plate Design: Optimizing fluid dynamics and utilizing high-thermal-conductivity materials to ensure exceptional temperature uniformity and high-efficiency heat dissipation during the Burn-In process, ultimately enhancing chip reliability.

• Liquid Cooling Control System: Enabling intelligent dynamic regulation through the real-time monitoring of flow rates, pressure, temperature, and various operational parameters. This ensures optimal energy efficiency and maximum safety for the test platform under fluctuating load conditions.

• Related Hardware Test Equipment Development and Software Integration: Deeply integrating customized burn-in hardware development capabilities with dedicated control software. From establishing automated testing platforms to developing real-time data acquisition and monitoring software, KYEC achieves seamless inter-equipment communication and data visualization. This assists customers in significantly accelerating the R&D verification timelines for advanced chips while ensuring product quality.

KYEC will continue to leverage its exceptional testing technologies and software-hardware integration advantages. By partnering with top-tier global semiconductor leaders, KYEC is fully equipped to tackle the chip testing and thermal management challenges of the high-power era.