King Yuan Electronics: A Global Leader in Semiconductor Testing Services Providing Comprehensive, High-Quality Professional Solutions.

King Yuan Electronics Co., Ltd. (KYEC; TWSE: 2449.TW) specializes in semiconductor chip testing services. Ranked second globally in testing revenue, KYEC is the world's largest pure-play semiconductor testing company. KYEC has established itself as a global market leader in high-end chip testing—particularly for AI chips, including GPUs, ASICs, CPUs, and networking chips.

Company Introduction
Founded in May 1987, KYEC is headquartered in Hsinchu City, Taiwan, near the Gongdao 5th Rd. Its manufacturing facilities in Taiwan are located in Miaoli County (Chunan, Tongluo, and Toufen Factory site) and Taoyuan City (Yangmei Factory site). Beyond Taiwan, KYEC established a testing facility in Singapore in 2026 and plans to build a factory in the United States. It also maintains sales offices in North America, Japan, and Singapore to provide real-time service to global clients.

Core Businesses

KYEC provides a wide array of testing services, primarily including:

1. Chip Probing (CP): Conducted after front-end wafer fabrication and before dicing/packaging, CP uses probe cards to perform electrical tests on each die on the wafer. This filters out defective dies early, improving downstream packaging yield and reducing overall manufacturing costs.
2. Final Testing (FT): Executed after die packaging is complete to ensure shipped chips meet product specifications. FT is KYEC's primary revenue driver (accounting for over 50% of revenue) and is widely applied to complex AI GPUs, ASICs, CPUs, communication chips, consumer chips, automotive chips, and industrial chips.
3. Burn-In Testing: Subjects chips to long-duration stress testing under extreme high-temperature and high-voltage conditions to accelerate the elimination of infant mortality failures. This addresses the ultra-high power consumption and extreme reliability demands of AI/HPC and automotive chips. KYEC possesses industry-leading, in-house developed equipment for ultra-high-power burn-in testing.
4. System-Level Testing (SLT): Captures potential defects and compatibility issues during actual system operation, high-workload computing, and multi-chip collaboration, serving as a critical quality defense before shipping highly complex AI and HPC chips.

Product Line Coverage: From an end-application perspective, KYEC tests a broad range of products, including HPC (High-Performance Computing, such as AI GPUs, ASICs, CPUs), communications, consumer electronics, automotive, and industrial products. In terms of technical specifications, coverage includes System-on-Chip (SoC), Logic and Mixed-Signal, CMOS Image Sensors (CIS/CCD), Liquid Crystal Display Drivers (LCDD), Radio Frequency (RF/Wireless), and Micro-Electro-Mechanical Systems (MEMS), supported by a fleet of over 5,900 test systems.