Wafer Probing Final Test Burn-in System Level Testing (SLT) Back end service

KYEC provides Burn-in services covering various products and packages including memory, microprocessors, GPU and other semiconductor VLSI devices. The in-house burn-in oven with test system can handle advanced requirements through its ability to perform Monitoring Burn-in (MBI), Dynamic Burn-in (DBI) and Testing During Burn-in (TDBI). Our specialized equipment includes auto-loader/unloader, lead scanners, lead reformers and burn-in systems.

IC Burn-In System

Type Model Channels Slots
MBI KYE-600 180 56
MBI/Logic KYE-680 180 56

Wafer Level Burn-In System

Model Vendor Vector Memory Rate Pins
P2000 JEC 32K 10 MHz 512

KYEC are able to provide extra service for BIB/kit design and test program development to support our customers.

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