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Wafer Probing Final Test Burn-in System Level Testing (SLT) Back end service

King Yuan Electronics (KYEC) provides burn-in services for products across a wide variety of package types, including AI-related chips (AI GPUs, AI ASICs, AI CPUs), memory devices, microprocessors, graphics processing units (GPUs), 5G base station components, and other Very Large Scale Integration (VLSI) semiconductor devices.

Our in-house developed burn-in ovens equipped with integrated test systems can fulfill advanced process requirements for various products through Monitored Burn-In (MBI) and Dynamic Burn-In (DBI) modes. Our specialized equipment includes automatic loaders/unloaders, lead scanners, lead reformers, and burn-in systems.

IC Burn-In System

Type  Model Channels Slots
Low Power Product KYE-600 180 36
High Power Product HP-600(2K/3K watt) 180 20
High Power Product HP-320(2K/3K watt) 256 20
High Power Product KITS-HP600_Q 180 10 / rack
High Power Product KITS-HP320_Q 256 10 / rack
High Power Product KITS-HP520_Q 384 10 / rack

Wafer Level Burn-In System

Model Vendor Vector Memory Rate Pins
P2000 JEC 32K 10 MHz 512

KYEC are able to provide extra service for BIB/kit design and test program development to support our customers.

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