For final testing of logic, mixed-signal, and radio frequency (RF) products, King Yuan Electronics (KYEC) provides a broad range of advanced test solutions with test frequencies ranging from several hundred kHz to 24–77 GHz. The test equipment is primarily sourced from leading international test system vendors.

Final test capabilities accommodate small-footprint devices under 1.5 mm × 1.5 mm up to large-scale packages exceeding 100 mm × 100 mm. This encompasses standard and advanced packaging forms, including traditional 2D packages, advanced 2.5D (such as CoWoS), 3D (SoIC), and hybrid architecture packaged chips.

The operation temperature ranges from -55^oC to 150^oC. For some advanced process node devices, KYEC also provides handler solutions with ATC function and/or ESD 0 option.