Wafer Probing Final Test Burn-in System Level Testing (SLT) Back end service

In the final testing of logic, mixed-signal and RF products, KYEC provides a wide range of test solutions, with test frequencies ranging from a few hundreds of KHz up to 60 GHz on ATEs from major international tester vendors.

The capability in final test includes small packages less than 3x3mm to large packages over 70mm x 70mm and covers the following form factors: PDIP, PLCC, full SOIC range (SOP, TSOP, TSSOP, MSOP), QFP, LQFP, TQFP, QFN , BGA , LGA , CSP , SIP, POP and certain types of modules.

The operation temperature ranges from -55oC to 150oC. For some advanced process node devices, KYEC also provides handler solutions with ATC function and/or ESD 0 option.

The production environment is classified to Class 100 and class 1000 for CCD/CIS products. Class 10,000 for other packages.

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