目前KYEC已成功開發WLCSP testing的先進技術。我們使用POGO Pin形式去contact WLCSP進行測試作業。因WLCSP封裝,在進行下壓測試時,能夠深達200um,故該設計能夠克服該WLCSP封裝錫球大小不同的變化。同時,我們也已成功開發128 sites測試解決方案並量產中。

未來,WLCSP在後段業務的角色,將隨高階後段封測製程發展趨勢而越趨重要,因為未來的趨勢,將在CP環境就直接測試FT測試規格,發展Handle(小IC)機構模組,減少客戶端之測試時間及成本及測試廠配件製作成本。京元電子在此一重要的技術發展競爭中,絕對不會缺席。

Achievement

WLCSP Testing Achievement

128 sites parallel testing is successful.

Pogo pin container & PCB & interface are all developed by KYEC.

Several CSP products are in production.

128 sites parallel testing is developing.

Cost? Very effective compare to other vertical type probe card.

Capability

KYEC design POGO Pin Contact for WLCSP. The overdrive capability up 200um could overcome WLCSP ball high variation

Item Specification
Bump pitch 500 μm
Probe Area 45mm x 30 mm
Tip planarity ± 20 μm
Temperature range -40℃ ~ 120 ℃
Contact Site 128 Site
Solder Ball Diameter 250 μm
XY accuracy ± 50 μm
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