ZKT是目前大陸最大的Memory Card封裝代工廠,可以提供一整套加工服務,包括基板設計,封裝和測試,種類涵蓋Micro SD、UDP、USB、HSSD等等。並且現在已經切入大陸興起的移動支付解決方案—特殊卡的生產,已經量產的封裝形式有RFID-SIM、Micro SIM、RFID-Micro SD、Nano SIM

Features:

Substrate design capability

4 Die Stack Capability

Ultra-thin wafer Handling Capability

Ultra Short / Long Wire Span Capability

Memory Card Spec
MMC Mobile (21.5×12.7mm)
Mini-IStick (11.2×20mm)
USB COB (11.3×24.8mm)
SIM Card (15×25mm)
MMC Micro (12×14mm)
Sim T-Card (11×15mm)
UDM (13×20mm)
UDP (11.3×24.8mm)
microUDP (11×15mm)
USB 3.0 (11.3×24.8mm)
microSD 3.0 (11×15mm)
Micro SD (11×15mm)
Micro Module (7.8×15mm)
Mini-SD (15×18mm)
Mini-SD Module (15×18mm)
HSSD (21.5×13mm)
FSSD (21.5×27mm)
SIM Card+RF Application (15×25mm)
RF-ID SIM Card (15×25mm)
RF-ID SD Card (11×15mm)
Micro SIM Card (12×15mm)
NanoSIM Card (8.8×12.3mm)
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