Wafer Probe
Final Test
Pre-Assembly
Burn-In
Backend
 


Burn-In Service

At KYEC we offer excellent own brand burn-in oven, for burn in services covering Monitoring Burn-In(MBI), Dynamic Burn-In (DBI) and Testing During Burn-In (TDBI). Our burn-in services cover most of the products and packages including EDODRAM, SDRAM, SGRAM, SRAM, DDR, Flash, Memory Cards, EPROM, Embedded Memory, SIP, SOC's and ASIC's. Our specialized equipment includes auto-loader/unloader, lead scanners, lead reformers and Burn-in systems.

IC Burn-In System
Type Model Channels/ Slots
DBI CEC-320 30 112
DBI CEC-560 72 72
MBI KYE-600 184 56
TDBI KYE-660 184 56
MBI/Logic KYE-680 184 56

Wafer Level Burn-In System
Model Vendor V.M. Rate Pins
P2000 JEC 32K 10MHz 512

KYEC are able to provide extra service for BIB/kit design and test program development to support our customers.


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