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 Wafer Dicing 
The services available at KYEC consist of single cut through or dual cut for 4”, 5”,6”,8”and 12” wafers .This includes silicon wafer, glass based , sensor, dual material , solder or gold bumped wafers. |
Waffle Packing
KYEC provides waffle pack as part of the Pre-Assembly Services for LCD drivers, KGD and other application with ink or inkless dice (wafer map). KYEC can also offer wafer on ring for RFID and similar applications. |
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