 Pre-Assembly |
 Wafer
Grinding |
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KYEC has the capability to provide a dedicated Pre-Assembly Service (PAS) to our customers. We offer a total solution for Wafer Grinding, Wafer Dicing and Waffle Pack or Wafer on Ring . Our solutions support for Wafer-to-Wafer , Laser Mark, Tape & Reel, WLP, F/C, COG, COB ,KGD and a full range of LCD Drivers. We also offer 100% visual inspection of all dice in waffle pack. Pre-Assembly services are performed in class 100 clean room.
 Wafer Grinding 
KYEC provides wafer grinding services for silicon wafers, including gold and solder bumped wafers. Our core strengths are on wafer grinding includes:
 Grinding thickness:
 Mass Production: 4 mils for 6”wafers, 2 mils for 8” wafers and 12” wafers
Engineering capability: 2 mils for 6”wafers, 1.5 mils for 8” wafers and 12” wafers |
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