Wafer Probe Final Test Pre-Assembly Burn-In Backend   KYEC offers a wide variety of services.       KYEC provides a full range of wafer probing services. KYEC provides full final test services prior to shipment / drop ship. KYEC provides Pre-Assembly services including wafer grind, wafer saw, waffle pack or wafer on ring. KYEC can offer full range of burn-in services. Backend services includes Lead Scan / reform, Tape& Reel and drop ship.     Test Solutions Test Services About KYEC Press Room Employment My Fab Contact KYEC Copyright© 2004 King Yuan ELECTRONICS CO., LTD. All rights reserved.   Designed by CREATOP