Pre-assembly Service
KYEC has the capability to provide a professional pre-assembly service to our customers. We offer a total solution for:

Wafer Grinding

Dicing Saw

Waffle Pack

Side Braze

Our engineering strength support Wafer-to-Wafer, Laser Mark, Tape & Reel, WLP, F/C, COG, COB and various types of LCD Driver package types. We also offer 100% visual inspection for all on tray chips.