KYEC has the capability to provide a dedicated Pre-Assembly Service (PAS) to our customers. We offer a total solution for Wafer Grinding, Wafer Dicing and Waffle Pack or Wafer on Ring . Our solutions support for Wafer-to-Wafer , Laser Mark, Tape & Reel, WLP, F/C, COG, COB ,KGD and a full range of LCD Drivers. We also offer 100% visual inspection of all dice in waffle pack. Pre-Assembly services are performed in class 100 clean room.
Wafer GrindingKYEC provides wafer grinding services for silicon wafers, including gold and solder bumped wafers. Our core strengths are on wafer grinding includes:Grinding thickness:Mass Production: 4 mils for 6”wafers, 2 mils for 8” wafers and 12” wafers Engineering capability: 2 mils for 6” wafers, 1.5 mils for 8” wafers and 12” wafers.
Wafer DicingThe services available at KYEC consist of single cut through or dual cut for 4”, 5”,6”,8”and 12” wafers .This includes silicon wafer, glass based , sensor, dual material , solder or gold bumped wafers.
Waffle PackingKYEC provides waffle pack as part of the Pre-Assembly Services for LCD drivers, KGD and other application with ink or inkless dice (wafer map). KYEC can also offer wafer on ring for RFID and similar applications.