目前KYEC已成功开发WLCSP testing的先进技术。我们使用POGO Pin形式去contact WLCSP进行测试作业。因WLCSP封装,在进行下压测试时,能够深达200um,故该设计能够克服该WLCSP封装锡球大小不同的变化。同时,我们也已成功开发128 sites测试解决方案并量产中。

未来,WLCSP在後段业务的角色,将随高阶後段封测制程发展趋势而越趋重要,因为未来的趋势,将在CP环境就直接测试FT测试规格,发展Handle(小IC)机构模组,减少客户端之测试时间及成本及测试厂配件制作成本。京元电子在此一重要的技术发展竞争中,绝对不会缺席。

Achievement

WLCSP Testing Achievement

128 sites parallel testing is successful.

Pogo pin container & PCB & interface are all developed by KYEC.

Several CSP products are in production.

128 sites parallel testing is developing.

Cost? Very effective compare to other vertical type probe card.

Capability

KYEC design POGO Pin Contact for WLCSP. The overdrive capability up 200um could overcome WLCSP ball high variation

Item Specification
Bump pitch 500 μm
Probe Area 45mm x 30 mm
Tip planarity ± 20 μm
Temperature range -40℃ ~ 120 ℃
Contact Site 128 Site
Solder Ball Diameter 250 μm
XY accuracy ± 50 μm
top