ZKT是目前大陆最大的Memory Card封装代工厂,可以提供一整套加工服务,包括基板设计,封装和测试,种类涵盖Micro SD、UDP、USB、HSSD等等。并且现在已经切入大陆兴起的移动支付解决方案—特殊卡的生产,已经量产的封装形式有RFID-SIM、Micro SIM、RFID-Micro SD、Nano SIM

Features:

Substrate design capability

4 Die Stack Capability

Ultra-thin wafer Handling Capability

Ultra Short / Long Wire Span Capability

Memory Card Spec
MMC Mobile (21.5×12.7mm)
Mini-IStick (11.2×20mm)
USB COB (11.3×24.8mm)
SIM Card (15×25mm)
MMC Micro (12×14mm)
Sim T-Card (11×15mm)
UDM (13×20mm)
UDP (11.3×24.8mm)
microUDP (11×15mm)
USB 3.0 (11.3×24.8mm)
microSD 3.0 (11×15mm)
Micro SD (11×15mm)
Micro Module (7.8×15mm)
Mini-SD (15×18mm)
Mini-SD Module (15×18mm)
HSSD (21.5×13mm)
FSSD (21.5×27mm)
SIM Card+RF Application (15×25mm)
RF-ID SIM Card (15×25mm)
RF-ID SD Card (11×15mm)
Micro SIM Card (12×15mm)
NanoSIM Card (8.8×12.3mm)
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