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| 晶圓研磨(Pre-Assembly Services) |
KYEC has the capability to provide a dedicated Pre-Assembly Service (PAS) to our customers. We offer a total solution for Wafer Grinding, Wafer Dicing and Waffle Pack or Wafer on Ring . Our solutions support for Wafer-to-Wafer , Laser Mark, Tape & Reel, WLP, F/C, COG, COB ,KGD and a full range of LCD Drivers. We also offer 100% visual inspection of all dice in waffle pack. Pre-Assembly services are performed in class 100 clean room.
 晶圓研磨 
KYEC provides wafer grinding services for silicon wafers, including gold and solder bumped wafers. Our core strengths are on wafer grinding includes:
 Grinding thickness:
 Mass Production: 4 mils for 6" and 8” wafers, 8 mils for 12” wafers
Engineering capability: 2 mils for 6” and 8” wafers, 2 mils for 12” wafers |
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晶圓研磨
