晶圓針測
IC成品測試
晶圓研磨/切割/晶粒挑揀
預燒(burn-in)
掃腳&代客出貨
我們提供多項的服務,請點選觀看內容
KYEC provides a full range of wafer probing services.
KYEC provides full final test services prior to shipment / drop ship.
KYEC provides Pre-Assembly services including wafer grind, wafer saw, waffle pack or wafer on ring.
KYEC can offer full range of burn-in services.
Backend services includes Lead Scan / reform, Tape& Reel and drop ship.
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測試服務
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