晶片探測技術
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KYEC provides a full range of wafer probing services.
KYEC provides full final test services prior to shipment / drop ship.
KYEC provides Pre-Assembly services including wafer grind, wafer saw, waffle pack or wafer on ring.
KYEC can offer full range of burn-in services.
Backend services includes Lead Scan / reform, Tape& Reel and drop ship.
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