晶圓針測
IC成品測試
晶圓研磨/切割/晶粒挑揀
預燒(burn-in)
掃腳&代客出貨
 

 


我們提供多項的服務,請點選觀看內容

 


 

 

KYEC provides a full range of wafer probing services.
KYEC provides full final test services prior to shipment / drop ship.
KYEC provides Pre-Assembly services including wafer grind, wafer saw, waffle pack or wafer on ring.
KYEC can offer full range of burn-in services.
Backend services includes Lead Scan / reform, Tape& Reel and drop ship.

 

 


測試問題解答 測試服務 有關京元

工作專區

我的專區 與我們連絡