晶片探測技術
最後測試
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預燒機台
裝封服務
 

 


我們提供多項的服務,請點選觀看內容

 


 

 

KYEC provides a full range of wafer probing services.
KYEC provides full final test services prior to shipment / drop ship.
KYEC provides Pre-Assembly services including wafer grind, wafer saw, waffle pack or wafer on ring.
KYEC can offer full range of burn-in services.
Backend services includes Lead Scan / reform, Tape& Reel and drop ship.

 

 


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